Description

Why we use Thermal Paste:

Although the surface of a computer’s processor (IHS top) and your cooler base plate (AIO cold plate or Air cooler) look polished and flat, they have microscopic dents or imperfections.

So a thermal paste is used to fill these cavities/dents to provide maximum thermal conductivity which helps to dissipate  heat quickly and  effectively between the CPU/GPU and the cooler.

TKF TG-01 Thermal paste:

TG-01 is made of non-conductive & non-volatile compounds, which makes it safe to use for you and your PC.

Higher grade Thermal Compound

Best for long term usage and stability.

Technical Specifications:

Thermal Conductivity: 8.5 W/mK

Thermal Impedance: <0.0019 oC-in2/W

Viscosity: Flow

Specific Gravity:2.3g/cm³

Operational Temperature: -30 ~ 200oC

Color: Grey

Weight: 3 grams

Silicone Compounds: 32%

Carbon Compounds: 33%

Metal Oxide Compounds: 35%

Not electrically Conductive & non-corroding

Based on performed tests on lab submitted sample(s),

RoHS directive (EU) 2015/863 amending Annex II to directive 2011/65/EU

Package Details:

Width: 70 mm

Length: 150 mm

Weight: 11 gm